Qiren Electronics Co., Ltd. is a leading OEM manufacturer specializing in Connector Parts Injection Molding, offering high-precision, durable solutions for 5G, automotive, and consumer electronics. Using advanced thermoplastic materials (PC, LCP, PA66, etc.), Qiren ensures product reliability and performance.
Qiren Electronics Co., Ltd. is a modern high-tech enterprise specializing in connector R&D, manufacturing and sales, with rich experience and technical accumulation in the field of connectors. The company focuses on product quality and technological innovation, and is committed to providing customers with high-quality connector products.
Our process includes design, mold manufacturing, injection molding, and automated post-processing, delivering high-quality connectors with miniaturized, high-speed, and integrated designs. Partner with Qiren for cutting-edge injection molding technology.
Injection molding of connector parts is a manufacturing process in which thermoplastics are injected into the mold cavity under high temperature and high pressure, and then cooled and solidified to form electronic connector parts with specific shapes, sizes and functions.
Our plastic injection molding parts are made of a variety of materials, including PC, LCP, ABS, POM, PP, POK, PBT, PA9T, PA6 ,PA66PET, PC+ABS to ensure durability and reliability of user input applications (such as home appliances).
I. Preliminary preparation
1. Design model and material selection
2. Mold manufacturing
II. Injection molding stage
1. Melt plastic
2. Plastic injection
3. Pressure maintenance
4. Cooling
III. Post-processing
1. Mold opening
2. Cut finished product
Connector parts injection molding has three core advantages, high-precision molding, material innovation, and automated production, which comprehensively surpass traditional processes in performance, efficiency, and cost. With the rapid development of 5G, new energy vehicles and other fields, injection molding technology will continue to promote the evolution of connectors towards miniaturization, high speed, and integration, and become one of the key technologies for future electronic manufacturing.